Jasecen International (HK) Co. Ltd
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Products
Jasecen International (HK) Co. Ltd
High-density 12-layer rigid and flex PCB with high technology for electronics
  • High-density 12-layer rigid and flex PCB with high technology for electronics
High-density 12-layer rigid and flex PCB with high technology for electronics

High-density 12-layer rigid and flex PCB with high technology for electronics

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • High-density printed circuit board with high quality and high technology
  • Suitable for high-end electronic products
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 1.6mm
  • Hole diameter: ≥0.2mm
  • Black solder mask
  • Surface technology: lead-free HASL and immersion gold
  • Board types:
    • Multilayer rigid PCBs: up to 18 layers
    • Flexible and flex-rigid circuits: up to 18 layers
    • Controlled impedance
    • HDI (high-density interconnection)
    • Blind and buried via holes
    • Compliant with the RoHS directives
    • Standard: UL
  • Substrates:
    • FR4 standard epoxy and high-temperature versions
    • Polyamide, polyester and PET
    • PTFE (poly-tetra fluorethylene), Duroid (glass-reinforced PTFE composite) and aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficient of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo image-able solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Gold plating
    • Immersion tin
  • Multilayer rigid PCBs: up to 18 layers
  • Flexible and flex-rigid circuits: up to 18 layers
  • Controlled impedance
  • HDI (high-density interconnection)
  • Blind and buried via holes
  • Compliant with the RoHS directives
  • Standard: UL
  • FR4 standard epoxy and high-temperature versions
  • Polyamide, polyester and PET
  • PTFE (poly-tetra fluorethylene), Duroid (glass-reinforced PTFE composite) and aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficient of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo image-able solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Gold plating
  • Immersion tin

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