Jasecen International (HK) Co. Ltd
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Jasecen International (HK) Co. Ltd
Export standard FR4 PCB with immersion tin, matte green solder mask and 2.0mm thickness
  • Export standard FR4 PCB with immersion tin, matte green solder mask and 2.0mm thickness
Export standard FR4 PCB with immersion tin, matte green solder mask and 2.0mm thickness

Export standard FR4 PCB with immersion tin, matte green solder mask and 2.0mm thickness

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Export standard FR4 PCB with matte green solder mask
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 2.0mm
  • Hole diameter: ≥0.2mm
  • Black solder mask
  • Surface technology: lead-free HASL, immersion gold
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled Impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
    • RoHS and UL compliant on request
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
      PTFE (polytetraflourethylene) and Duroid (glass reinforced PTFE composite)
    • Aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photoimageable solder mask)
    • range of colours available
    • Peel-able solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled Impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • RoHS and UL compliant on request
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
    PTFE (polytetraflourethylene) and Duroid (glass reinforced PTFE composite)
  • Aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photoimageable solder mask)
  • range of colours available
  • Peel-able solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin

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