Jasecen International (HK) Co. Ltd
Products
Products
Jasecen International (HK) Co. Ltd
4.0mm of thickness copper of 3oz immersion gold PCB with FR4 material
  • 4.0mm of thickness copper of 3oz immersion gold PCB with FR4 material
4.0mm of thickness copper of 3oz immersion gold PCB with FR4 material

4.0mm of thickness copper of 3oz immersion gold PCB with FR4 material

Get Latest Price
Payment Type:
T/T or Western Union
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 2.0
  • Hole diameter: ≥0.2mm
  • Solder mask: black
  • Surface technology: lead-free HASL, immersion gold
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled Impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
    • Compliant with UL and the RoHS Directives
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyamide, polyester and PET
      PTFE (poly-tetra fluorethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo image-able solder mask)
    • Various colors are available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled Impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • Compliant with UL and the RoHS Directives
  • FR4 standard epoxy and high temp versions
  • Polyamide, polyester and PET
    PTFE (poly-tetra fluorethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo image-able solder mask)
  • Various colors are available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin

    • Send your message to this supplier

    • Ms.  Joy

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories