Jasecen International (HK) Co. Ltd
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Products
Jasecen International (HK) Co. Ltd
4-layer Immersion Tin FR4 PCB with Green Solder Mask
  • 4-layer Immersion Tin FR4 PCB with Green Solder Mask
4-layer Immersion Tin FR4 PCB with Green Solder Mask

4-layer Immersion Tin FR4 PCB with Green Solder Mask

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Basic Info
Basic Info
Payment Type: T/T, Western Union
Product Description
Product Description
  • 4-layer immersion tin FR4 PCB
  • Minimum line width: ≥0.08mm
  • Minimum line spacing: ≥0.08mm
  • Thickness: 2.0mm
  • Hole diameter: ≥0.2mm
  • With green solder mask
  • Surface technology: lead-free HASL and immersion gold
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyamide, polyester and PET
    • PTFE (poly-tetra fluorethylene) and Duroid (glass reinforced PTFE composite)
    • Aluminum based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo imageable solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • FR4 standard epoxy and high temp versions
  • Polyamide, polyester and PET
  • PTFE (poly-tetra fluorethylene) and Duroid (glass reinforced PTFE composite)
  • Aluminum based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo imageable solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy

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