Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
Double-sided communication equipment PCB with green solder mask and HASL
  • Double-sided communication equipment PCB with green solder mask and HASL
Double-sided communication equipment PCB with green solder mask and HASL

Double-sided communication equipment PCB with green solder mask and HASL

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Basic Info
Basic Info
Payment Type: T/T, Western Union
Product Description
Product Description
  • Double-sided communication equipment PCB with green solder mask and HASL
  • Thickness: 1.6mm
  • Rigid PCB
  • Material: FR-4
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled Impedance
    • HDI (high density interconnect)
    • Blind and Buried via holes
    • RoHS and UL compliant on request
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    •  CNC routing
    •  Scoring (V-Grooving)
    •  Gold on Nickel contact fingers
    •  LPSM (liquid photoimageable solder mask) range of colours available
    •  Peelable solder mask
    •  Screened conductive Inks (carbon)
    •  Bare board electrical testing
  • Board finishes:
    • Immersion: silver
    • Immersion: gold
    • Lead free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating: gold
    • Immersion: tin
  • We also offer:
    •  PCB design
    •  Circuit layout and drafting
    •  PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled Impedance
  • HDI (high density interconnect)
  • Blind and Buried via holes
  • RoHS and UL compliant on request
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetraflourethylene) and Duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  •  CNC routing
  •  Scoring (V-Grooving)
  •  Gold on Nickel contact fingers
  •  LPSM (liquid photoimageable solder mask) range of colours available
  •  Peelable solder mask
  •  Screened conductive Inks (carbon)
  •  Bare board electrical testing
  • Immersion: silver
  • Immersion: gold
  • Lead free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating: gold
  • Immersion: tin
  •  PCB design
  •  Circuit layout and drafting
  •  PCB copy
  • Send your message to this supplier

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