Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
2-layer immersion gold surface finish PCB with keys
  • 2-layer immersion gold surface finish PCB with keys
2-layer immersion gold surface finish PCB with keys

2-layer immersion gold surface finish PCB with keys

Payment Type:
T/T and Western Union
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Basic Info
Basic Info
Payment Type: T/T and Western Union
Product Description
Product Description
  • Details:
    • Double-sided
    • Thickness: 1.6mm
    • Material: FR-4
  • Board types:
    • Multilayer rigid PCBs up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
    • Compliant with RoHS Directive
    • Meets UL requirements
  • Substrates:
    • FR-4 standard epoxy and high temp versions
    • Polyamide, polyester and PET
    • PTFE (poly-tetra fluoroethylene) and duroid (glass reinforced PTFE composite)
    • Aluminum-based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion or higher TG levels
  • Board options:
    • CNC routing
    • Scoring (V grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photo image-able solder mask) range of colors available
    • Peelable solder mask
    • Screened conductive Inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Gold plating
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Double-sided
  • Thickness: 1.6mm
  • Material: FR-4
  • Multilayer rigid PCBs up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • Compliant with RoHS Directive
  • Meets UL requirements
  • FR-4 standard epoxy and high temp versions
  • Polyamide, polyester and PET
  • PTFE (poly-tetra fluoroethylene) and duroid (glass reinforced PTFE composite)
  • Aluminum-based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion or higher TG levels
  • CNC routing
  • Scoring (V grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photo image-able solder mask) range of colors available
  • Peelable solder mask
  • Screened conductive Inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Gold plating
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy
  • Send your message to this supplier

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    • Enter between 20 to 4,000 characters.

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