Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
Copper Multilayer PCB
  • Copper Multilayer PCB
Copper Multilayer PCB

Copper Multilayer PCB

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • Specifications:
    • Layer
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: lead free HAL
    • Solder mask: green
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
  • The following is the whole manufacturing capability:
    • Materials: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
    • Layers: 1-18
    • Finishing board thickness: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
  • Images:
    • Minimum trace width: 0.075mm (3-mil)
    • Minimum space width: 0.075mm (3-mil)
    • SMD pitch: 0.2mm (8-mil)
    • BGA pitch: 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam: 0.0635mm (2.5-mil)
    • Solder mask clearance: 0.075mm (3-mil)
    • Minimum SMT pad spacing: 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Layer
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead free HAL
  • Solder mask: green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Materials: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
  • Layers: 1-18
  • Finishing board thickness: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Minimum trace width: 0.075mm (3-mil)
  • Minimum space width: 0.075mm (3-mil)
  • SMD pitch: 0.2mm (8-mil)
  • BGA pitch: 0.2mm (8-mil)
  • Minimum solder mask dam: 0.0635mm (2.5-mil)
  • Solder mask clearance: 0.075mm (3-mil)
  • Minimum SMT pad spacing: 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
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