Jasecen International (HK) Co. Ltd
Jasecen International (HK) Co. Ltd
Ceramic PCBs for LED light, with thick film circuit
  • Ceramic PCBs for LED light, with thick film circuit
Ceramic PCBs for LED light, with thick film circuit

Ceramic PCBs for LED light, with thick film circuit

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T/T or Western Union
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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • With thick film circuit
  • Hole: 0.2mm
  • Ceramic-based
  • Application: LED light
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high density interconnect)
    • Blind and buried via holes
  • Certification: UL
  • RoHS Directive-compliant
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetrafluorethylene) and duroid (glass reinforced PTFE composite)
    • Aluminium based
    • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher TG levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM (liquid photoimageable solder mask) range of colours available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finish:
    • Immersion silver
    • Immersion gold
    • Lead-free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating: gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high density interconnect)
  • Blind and buried via holes
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetrafluorethylene) and duroid (glass reinforced PTFE composite)
  • Aluminium based
  • Ceramic and exotic substrates with higher maximum operating temperature, lower coefficients of expansion and/or higher TG levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM (liquid photoimageable solder mask) range of colours available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead-free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating: gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy
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