Jasecen International (HK) Co. Ltd
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Products
Jasecen International (HK) Co. Ltd
2-layer LED Light PCB with Aluminum Base Board and 1oz Copper, for Auto
  • 2-layer LED Light PCB with Aluminum Base Board and 1oz Copper, for Auto
2-layer LED Light PCB with Aluminum Base Board and 1oz Copper, for Auto

2-layer LED Light PCB with Aluminum Base Board and 1oz Copper, for Auto

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Basic Info
Basic Info
Payment Type: T/T or Western Union
Product Description
Product Description
  • LED light PCB with aluminum base board and 1oz copper
  • Material: aluminum substrate
  • Thickness: 1.6mm
  • Rigid
  • Flame resistance: V2
  • Board thickness: 1.6mm
  • Layer: 2
  • Solder mask: white
  • Finish: HAL-LF
  • Application: auto
  • Board types:
    • Multilayer rigid PCB's up to 18 layers
    • Flexible and flex-rigid circuits up to 18 layers
    • Controlled impedance
    • HDI (high-density interconnect)
    • Blind and buried via holes
    • Certification: UL
    • RoHS Directive-compliant
  • Substrates:
    • FR4 standard epoxy and high temp versions
    • Polyimide, polyester and PET
    • PTFE (polytetraflourethylene) and duriod (glass reinforced PTFE composite)
    • Aluminium based materials
    • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • Board options:
    • CNC routing
    • Scoring (V-grooving)
    • Gold on nickel contact fingers
    • LPSM  (liquid photoimageable solder mask) range of colours are available
    • Peelable solder mask
    • Screened conductive inks (carbon)
    • Bare board electrical testing
  • Board finishes:
    • Immersion silver
    • Immersion gold
    • Lead free or HASL (hot air solder leveling)
    • OSP (organic surface preservative)
    • Gold finger
    • Plating gold
    • Immersion tin
  • We also offer:
    • PCB design
    • Circuit layout and drafting
    • PCB copy
  • Multilayer rigid PCB's up to 18 layers
  • Flexible and flex-rigid circuits up to 18 layers
  • Controlled impedance
  • HDI (high-density interconnect)
  • Blind and buried via holes
  • Certification: UL
  • RoHS Directive-compliant
  • FR4 standard epoxy and high temp versions
  • Polyimide, polyester and PET
  • PTFE (polytetraflourethylene) and duriod (glass reinforced PTFE composite)
  • Aluminium based materials
  • Ceramic and exotic substrates with higher maximum operating temperatures, lower coefficients of expansion and/or higher Tg levels
  • CNC routing
  • Scoring (V-grooving)
  • Gold on nickel contact fingers
  • LPSM  (liquid photoimageable solder mask) range of colours are available
  • Peelable solder mask
  • Screened conductive inks (carbon)
  • Bare board electrical testing
  • Immersion silver
  • Immersion gold
  • Lead free or HASL (hot air solder leveling)
  • OSP (organic surface preservative)
  • Gold finger
  • Plating gold
  • Immersion tin
  • PCB design
  • Circuit layout and drafting
  • PCB copy

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