PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement

4 Layers PCB with Bounding, Immersion Gold, 2 oz Copper and Minimum Track Space of 4 Mils

Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish

1.0mm 4-layers PCB with Keystoke, 5/5mil Line Width or Space, Hard and Soft Gold

PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement

1.6mm 4-layer PCB with Lead Free SMOBC and HASL Finishes, 50μm Maximum Hard Gold Thickness