ABP Electronics Limited
ABP Electronics Limited
Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity
  • Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity
  • Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity
Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity
Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity

Communication PCB Assembly, SMD + DIP Process and 206 Components Pin Quantity

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Features
    • Client code: CM0522
    • PCBA product part no: AAB-MC02
    • PCBA application: Industrial
    • Assembly processes: SMD + DIP
    • Material FR-4
    • Board thicknesses: Normally 1.6mm, could be 0.2-6.0mm
    • Layer count: Have capacity to build 1-30 layer board. normally2~12 layers
    • Copper thickness: Normally 0.5, 1 and 2oz
    • Capacities: 0.5-6oz
    • Minimum line width and minimum spacing: e3 mils
    • Minimum drill hole size e0.15mm
    • Surface finish HASL and HASL (lead free), immersion tin,immersion silver, immersion gold, hard gold plating, yyttrtOSP,gold finger and so on
  • Client code: CM0522
  • PCBA product part no: AAB-MC02
  • PCBA application: Industrial
  • Assembly processes: SMD + DIP
  • Material FR-4
  • Board thicknesses: Normally 1.6mm, could be 0.2-6.0mm
  • Layer count: Have capacity to build 1-30 layer board. normally2~12 layers
  • Copper thickness: Normally 0.5, 1 and 2oz
  • Capacities: 0.5-6oz
  • Minimum line width and minimum spacing: e3 mils
  • Minimum drill hole size e0.15mm
  • Surface finish HASL and HASL (lead free), immersion tin,immersion silver, immersion gold, hard gold plating, yyttrtOSP,gold finger and so on
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    • Ms.  Winnie

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