ABP Electronics Limited
ABP Electronics Limited
PCB Assembly, Assembly Process SND and DIP
  • PCB Assembly, Assembly Process SND and DIP
  • PCB Assembly, Assembly Process SND and DIP
PCB Assembly, Assembly Process SND and DIP
PCB Assembly, Assembly Process SND and DIP

PCB Assembly, Assembly Process SND and DIP

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Client code: CM0536
  • ABP PCB & PCBA project no: SE4800
  • PCBA product part no: R7600002_DDP4422_MAIN_V1.0
  • PCBA application: industrial
  • Assembly process: SMD + DIP
  • Material: FR-4
  • Board thickness: normally 1.6mm, could be 0.2-6.0mm
  • Layer count: has capacity to build 1-30 layer board, normally2-12 layers
  • Copper thickness: normally 0.5oz, 1oz, 2oz
  • Capacity: 0.5-6oz
  • Minimum line width and minimum spacing: e3mil
  • Minimum drill hole size: e0.15mm
  • Surface finish: HASL and HASL (lead-free), immersion tin,immersion silver, immersion gold, hard gold plating, OSP, goldfinger and more
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