ABP Electronics Limited
ABP Electronics Limited
PCB Assembly for Industrial Applications, with SMD + DIP Processing
  • PCB Assembly for Industrial Applications, with SMD + DIP Processing
  • PCB Assembly for Industrial Applications, with SMD + DIP Processing
PCB Assembly for Industrial Applications, with SMD + DIP Processing
PCB Assembly for Industrial Applications, with SMD + DIP Processing

PCB Assembly for Industrial Applications, with SMD + DIP Processing

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • ABP PCB and PCBA project number: SE4511
  • PCBA application: industrial
  • Assembling process: SMD + DIP
  • Material: FR-4
  • Board thickness: normally 1.6mm, can also be 0.2-6.0mm
  • Layer count: have capacity to build 1-30 layers of board,normally 2-12 layers
  • Copper thicknesses: normally 0.5/1/2oz
  • Capacity range: 0.5-6oz
  • Minimum line width and minimum spacing: e3mil
  • Minimum drill hole size: ≥0.15mm
  • Surface finish: HASL and HASL (lead-free), immersion tin,immersion silver, immersion gold, hard gold plating, OSP, goldfinger and more
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