ABP Electronics Limited
ABP Electronics Limited
PCB Assembly, SMD and DIP Assembly Process
  • PCB Assembly, SMD and DIP Assembly Process
  • PCB Assembly, SMD and DIP Assembly Process
PCB Assembly, SMD and DIP Assembly Process
PCB Assembly, SMD and DIP Assembly Process

PCB Assembly, SMD and DIP Assembly Process

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Client code: CM0536
  • ABP PCB and PCBA project number: SE4809
  • PCBA product part no: R7600002-DDP4422-MAIN-V1.0
  • PCBA application: industrial
  • Assembly process: SMD + DIP
  • Material: FR-4
  • Board thickness: normally 1.6mm, could be 0.2-6.0mm
  • Layer count: has capacity to built 1-30 layer board, normally2-12 layers
  • Copper thickness: normally 0.5, 1, 2oz
  • Capacity: 0.5-6oz
  • Minimum line width and minimum spacing: e3-mil
  • Minimum drill hole size: e0.15mm
  • Surface finish: HASL and HASL (lead-free), immersion tin,immersion silver, immersion gold, hard gold plating, OSP, goldfinger and more
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