PCB Assembly, Assembly Process SND and DIP, Made of FR-4 Material

PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement

1.6mm 4-layer PCB with Lead Free SMOBC and HASL Finishes, 50μm Maximum Hard Gold Thickness

4-layers PCB with 0.8mm Thickness, Blue Solder Mask and Immersion Gold, Measures 1,000 x 1,200mm

FR4 TG180 1.6mm 6-layer PCB with Immersion Gold Finish, Suitable for Industry Test and Control

Four-layer PCB, Maximum Size of 1,000 x 1,200mm; HASL(lead Free), 2-ounce Copper