PCB Assembly with SMD and DIP Assembly Process

Four-layer Printed Circuit Board with Electroless Nickel/Immersion Gold Platings

4 Layers PCB with Bounding, Immersion Gold, 2 oz Copper and Minimum Track Space of 4 Mils

Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish

1.0mm 4-layers PCB with Keystoke, 5/5mil Line Width or Space, Hard and Soft Gold

PCB Assembly for Bluetooth Headset, 20/15/12 Mils Pitch and 0402 Placement