ABP Electronics Limited
ABP Electronics Limited
PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP
  • PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP
  • PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP
PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP
PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP

PCB Assembly, 2-layered Display Board, 19 Components Pin Quantity, Assembly Process and DIP

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Components quantity: 9
  • Components pin quantity: 19
  • Assembly process: SMT + DIP
  • Applications: consumer types
  • Material: FR4
  • Board thickness: normally 1.6mm, could be 0.2-6.0mm
  • Layer count: has capacity to build 1-30 layer board, normally2-12 layers
  • Copper thickness: normally 0.5, 1 and 2oz
  • Capacity range: 0.5-6oz
  • Minimum line width and minimum spacing: e3-mil
  • Minimum drill hole size: e0.15mm
  • Surface finishing: HASL and HASL (lead-free), immersion tin,immersion silver, immersion gold, hard gold plating, OSP, goldfinger and more
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