ABP Electronics Limited
ABP Electronics Limited
Four-layer Printed Circuit Board with Electroless Nickel/Immersion Gold Platings
  • Four-layer Printed Circuit Board with Electroless Nickel/Immersion Gold Platings
Four-layer Printed Circuit Board with Electroless Nickel/Immersion Gold Platings

Four-layer Printed Circuit Board with Electroless Nickel/Immersion Gold Platings

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Specifications:
    • Selective plating finishes: electroless nickel/immersion gold,SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold,plating tin, immersion silver and immersion tin
    • Base materials: high temperature FR4/FR5, free halogen FR4,aluminum based, Nelco 4000-13, Nelco 6000, polyamide, rogers4003/4350, rogers 3010, rogers 5880/5870, Taconic RF35A, TacPreg,TacLam, Arlon 25N/25FR, other Teflon and PTFE
    • Minimum track space: 4/4, 3 mils partial allowed
    • Layers and type: 1 to 30 layers standard PCB, Blind vias andburied vias board
    • Minimum annular ring: 3 mil for via hole, 6 mils for componenthole
    • Minimum space between the holes: 12 mil
  • Selective plating finishes: electroless nickel/immersion gold,SMOBC/HASL, lead free SMOBC/HASL, organic OSP, hard and soft gold,plating tin, immersion silver and immersion tin
  • Base materials: high temperature FR4/FR5, free halogen FR4,aluminum based, Nelco 4000-13, Nelco 6000, polyamide, rogers4003/4350, rogers 3010, rogers 5880/5870, Taconic RF35A, TacPreg,TacLam, Arlon 25N/25FR, other Teflon and PTFE
  • Minimum track space: 4/4, 3 mils partial allowed
  • Layers and type: 1 to 30 layers standard PCB, Blind vias andburied vias board
  • Minimum annular ring: 3 mil for via hole, 6 mils for componenthole
  • Minimum space between the holes: 12 mil
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