ABP Electronics Limited
ABP Electronics Limited
Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish
  • Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish
Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish

Tin Plated 4-layer PCB with BGA, 6oz Maximum Surface Copper Thickness and Immersion Silver Finish

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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Base materials: high temperature FR4 or FR5, free halogen FR4and aluminum, polyimide, Rogers, argon and other Teflon orPTFE
  • Layers: 1 to 30 layers standard PCB, blind vias and buried viasboard
  • Minimum track space: 4/4 and 3mils partial allowed
  • Surface copper thickness:
    Maximum: 6/6oz
    Minimum: 0.5/0.5oz
  • Hard gold thickness: Maximum: 50μm
  • Maximum board thickness: 6.0mm
  • Finishes: SMOBC or HASL, lead free SMOBC or HASL, organic OSP,hard and soft gold, tin plating, immersion silver, immersion tinand electrolysis nickel or immersion gold
  • Maximum size: 1,000 x 1,200mm
  • Minimum size: 3 x 3mm
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