ABP Electronics Limited
ABP Electronics Limited
PCB with BGA, Gold Finger, 1.0mm FR4, 4 or 4 and 3 Mils Track Space and 0.2mm Minimum Hole
  • PCB with BGA, Gold Finger, 1.0mm FR4, 4 or 4 and 3 Mils Track Space and 0.2mm Minimum Hole
PCB with BGA, Gold Finger, 1.0mm FR4, 4 or 4 and 3 Mils Track Space and 0.2mm Minimum Hole

PCB with BGA, Gold Finger, 1.0mm FR4, 4 or 4 and 3 Mils Track Space and 0.2mm Minimum Hole

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T/T
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Basic Info
Basic Info
Payment Type: T/T
Product Description
Product Description
  • Base materials:
    • High-temperature FR4/FR5
    • Free halogen FR4
    • Aluminum
    • Polyamide
    • Rogers
    • Arlon
    • Teflon/PTFE
  • 1 to 30 layers
  • Blind and buried vias board
  • Minimum track space: 4/4 and 3 mils partial allowed
  • Surface copper thickness:
    • Maximum: 6/6oz
    • Minimum: 0.5/0.5oz
  • Hard gold thickness:
    • Maximum: 50μ-inch
    • Maximum board thickness: 6.0mm
  • Finishing:
    • SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and softgold plating
    • Immersion silver
    • Immersion tin
    • Electroless nickel/immersion gold
  • Maximum size: 1,000 x 1,200mm
  • Minimum size: 3 x 3mm
  • High-temperature FR4/FR5
  • Free halogen FR4
  • Aluminum
  • Polyamide
  • Rogers
  • Arlon
  • Teflon/PTFE
  • Maximum: 6/6oz
  • Minimum: 0.5/0.5oz
  • Maximum: 50μ-inch
  • Maximum board thickness: 6.0mm
  • SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and softgold plating
  • Immersion silver
  • Immersion tin
  • Electroless nickel/immersion gold
  • Send your message to this supplier

    • Ms.  Winnie

    • Enter between 20 to 4,000 characters.

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