4-layer FPC Board with 1oz Copper and HASL Lead Free Surface Finish
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Mobile HDI PCB with 0.5 to 7.0oz Copper Thickness and 1 to 28 Layers
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Electronic Circuit, Widely Used for Customer Electronics, Punching, and Routing Profiling
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High Quality Multilayer PCB with 4mil Line Width and 0.3mm Minimum Hole Size
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High-density Multilayer PCB with 0.21 to 7.0mm Board Finished Thickness
Related Keywords
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Mobile HDI PCB with 0.5 to 7.0oz Copper Thickness and 1 to 28 Layers
Electronic Circuit, Widely Used for Customer Electronics, Punching, and Routing Profiling
High Quality Multilayer PCB with 4mil Line Width and 0.3mm Minimum Hole Size
High-density Multilayer PCB with 0.21 to 7.0mm Board Finished Thickness
Four-layer FPC with ENIG Surface Finish and PI 0.2mm Thickness
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Multilayer PCB with 4 Mils Line Width, 0.3mm Minimum Hole Size, and Red Solder Mask
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