6-layer PCB Board with ENIG, for Mobile Phone

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Product Description

6 layer pcb board with ENIG for mobile phone

Immersion Gold 6 layers of printed circuit board

Material FR-4 1.6mm 1OZ

Min line width/space: 0.2mm/0.17mm

Reference: our production capability for Rigid PCB

Layer: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free,rogers

Maximum finished board size: 23 x 25 (580 x 900mm)

Minimum drilled hole size: 3mil (0.075mm)

Minimum line width: 3mil (0.075mm)

Line spacing: 3mil (0.075mm)

Surface finish/treatment: HASL/HASL lead free, HAL, chemicaltin, chemical gold, immersion silver/gold, OSP, gold plating

Copper thickness: 0.5-7.0 OZ

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0 um (>1mil)

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate: UL, ISO 9001, ISO 14001

Special requirements: buried and blind vias+controlledimpedance +BGA

Profiling: punching, routing, V-CUT, beveling

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