Multilayer PCB with Finished Board Thickness of 0.21 to 7.0mm

Multilayer PCB with Finished Board Thickness of 0.21 to 7.0mm

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Basic Info

Payment Type:	Cash Advance (CA)

Product Description

Our fabrication capacity for rigid PCB:

Layer count: 1 to 28 layers
Board finished thickness: 0.21mm to 7.0mm
Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free andRogers
Maximum finished board size: 23 x 25mm
Minimum drilled hole size: 3mil (0.075mm)
Minimum line width: 3mil (0.075mm)
Minimum Line spacing: 3mil (0.075mm)
Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/fold, OSP, gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0um (>1mil)
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance: ±0.076 (PTH), ±0.05 (NPTH)
With UL mark
Special requirements: buried and blind via s + controlledimpedance + BGA
Profiling: punching, routing, V-cut and beveling
Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products
All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.

Layer count: 1 to 28 layers

Board finished thickness: 0.21mm to 7.0mm

Material: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free andRogers

Maximum finished board size: 23 x 25mm

Minimum drilled hole size: 3mil (0.075mm)

Minimum line width: 3mil (0.075mm)

Minimum Line spacing: 3mil (0.075mm)

Surface finish/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold, immersion silver/fold, OSP, gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask color: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0um (>1mil)

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

Shape tolerance: ±0.13

Hole tolerance: ±0.076 (PTH), ±0.05 (NPTH)

With UL mark

Special requirements: buried and blind via s + controlledimpedance + BGA

Profiling: punching, routing, V-cut and beveling

Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

All trademarks shown here are for reference purposesonly. They are the property of their respective owners, and we arenot authorized to sell items bearing such trademarks.

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