Multilayer PCB Board with 1.0 Thickness and Aluminum Metal Base

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Material: FR4

Thickness: 1.0mm

With RoHS and UL marks

Minimum line width: 0.1mm

Minimum line space: 0.1mm

Smallest hole: 0.1mm

Buried and blind via structure:

L1 to L2
L1 to L8
L2 to L3
L3 to L6
L6 to L7
L7 to L8

Surface processing: immersion gold

With green solder mark

Place sample order: 9 to 10 days

Mass production: 10 to 13 days (the first time should add 2 to3 days)

Our PCB capability:

High Tg minimum 170°C and frequency

Metal based: aluminum and more

Maximum panel size: 26 x 26 inches (660mm x 660mm)

Line width and spacing:

Minimum line width (internal): 4mil (0.1mm) for mass productionand 3mil for samples

Minimum line width (external): 4mil (0.1mm) for mass productionand 3mil for samples

Minimum line spacing (external): 4mil (0.1mm) for massproduction and 3mil for samples

Layer count and thickness: 2 to 12 layers

Minimum thickness (2 layers): 4mil (0.1mm)

Minimum thickness (4 layers): 12mil (0.3mm)

Minimum thickness (6 layers): 16mil (0.4mm)

Minimum thickness (8 layers): 24mil (0.6mm)

Maximum thickness (10 layers): 200mil (5.0mm)

Layer to layer registration: +/- 5mil (0.13mm)

Via/drill size: minimum drill hole diameter 10mil (0.25mm)

Minimum via size: 8mil (0.2mm)

Hole to hole tolerance: +/- 3mil (0.08mm)

Hole to edge tolerance: +/- 5mil (0.13mm)

Micro via: 4mil (0.1mm)

Solder mask: solder mask bridge between solder dam 3mil(0.07mm)

Warpage: 0.5%

Impedance: +/- 10%

Surface finish: hard gold, ENIG, HASL, carbon ink, OSP, (ENTEKCU 106 AX), immersion tin

Minimum SMT pitch: 12mil (0.2mm)

Minimum parts foot pins: 0201

Products involved fields: consume electronics, medicalequipments, industrial commands, communications, auto parts andmore

L1 to L2

L1 to L8

L2 to L3

L3 to L6

L6 to L7

L7 to L8

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