Multilayer (8L) HDI PCB, Made of FR4 TG170 Material, 1.6mm 2oz Copper Thickness

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Reference our production capability for rigid PCB

Layer: 1 to 28

Board finished thickness: 0.21 to 7.0mm

Material: FR-4, CEM-1, CEM-3, high TG 170, FR4 halogen free,Rogers

Finished board size: 23 x 25 (580 x 900mm) (maximum)

Drilled hole size: 3-mil (0.075mm) (minimum)

Line width: 3-mil (0.075mm) (minimum)

Line spacing: 3-mil (0.075mm) (minimum)

Surface finish/treatment: HASL/ HASL lead free, HAL, chemicaltin, chemical gold, immersion Silver/gold plating

Copper thickness: 0.5 to 7.0oz

Solder mask colors: green/yellow/black/white/red/blue

Copper thickness in hole: >25.0μm (>1 mil)

Shape tolerance: ±0.13

Hole tolerance:

Certificate: UL

Special requirement: buried and blind vias + controlledimpedance + BGA

Profiling: punching, routing, V-cut, beveling

Provides OEM services to all sorts of printed circuit boardassembly as well as electronic encased products

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

PTH: ±0.076

NPTH: ±0.05

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