Shenzhen Hongmy Precision Circuit Co. Ltd
Shenzhen Hongmy Precision Circuit Co. Ltd
Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen
  • Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen
  • Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen
Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen
Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen

Multilayer Black Rigid PCB with Manufacturer, 1.6mm Board, Made of FR4 Material, White Silkscreen

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Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal, Western Union
Product Description
Product Description
  • Specifications:
    • Layers count: 8
    • Board material: FR4
    • Board thickness: 1.6mm
    • Finished copper thickness: 1oz
    • Minimum drilling diameter: 0.3mm
    • Surface finish: HAL (lead-free)
    • Materials: FR-4, CEM-1, aluminum, Rogers, ta-conic, Greek andArlin
    • Finish board thickness: 0.2 to 3.2mm
    • External copper thickness: 35 to 210um
    • Internal copper thickness: 17 to 140um
    • Copper plating hole: 18 to 40um
    • Trace width and line spacing: 0.075/0.1mm (3/4 mils)
    • CNC hole diameter: 0.20mm (minimum)
    • Punching hole diameter: 0.9mm (35 mils) (minimum)
    • Panel size: 610 x 508mm (maximum)
    • Hole position tolerance: 0.075mm
    • Hole dimension tolerance:
      • RTH: 0.075mm
      • NPTH: 0.05mm
    • Outline tolerance:
      • CNS: 0.125mm
      • Punching: 0.15mm
    • Warp and twist: 0.70%
    • Solder mask bridge: 0.0635mm (minimum)
    • Distance between lines to board bridge:
      • Outline: 0.25mm (minimum)
      • V-cut: 0.40mm
    • Impedance control tolerance: ±10%
    • Test voltage: 10 to 300V
    • Solder mask types: green, yellow, red, white, blue, mattegreen, matte black and more
    • Surface finished: HASL, immersion gold, immersion silver,gold-plated, gold finger and OSP
  • Layers count: 8
  • Board material: FR4
  • Board thickness: 1.6mm
  • Finished copper thickness: 1oz
  • Minimum drilling diameter: 0.3mm
  • Surface finish: HAL (lead-free)
  • Materials: FR-4, CEM-1, aluminum, Rogers, ta-conic, Greek andArlin
  • Finish board thickness: 0.2 to 3.2mm
  • External copper thickness: 35 to 210um
  • Internal copper thickness: 17 to 140um
  • Copper plating hole: 18 to 40um
  • Trace width and line spacing: 0.075/0.1mm (3/4 mils)
  • CNC hole diameter: 0.20mm (minimum)
  • Punching hole diameter: 0.9mm (35 mils) (minimum)
  • Panel size: 610 x 508mm (maximum)
  • Hole position tolerance: 0.075mm
  • Hole dimension tolerance:
    • RTH: 0.075mm
    • NPTH: 0.05mm
  • Outline tolerance:
    • CNS: 0.125mm
    • Punching: 0.15mm
  • Warp and twist: 0.70%
  • Solder mask bridge: 0.0635mm (minimum)
  • Distance between lines to board bridge:
    • Outline: 0.25mm (minimum)
    • V-cut: 0.40mm
  • Impedance control tolerance: ±10%
  • Test voltage: 10 to 300V
  • Solder mask types: green, yellow, red, white, blue, mattegreen, matte black and more
  • Surface finished: HASL, immersion gold, immersion silver,gold-plated, gold finger and OSP
  • RTH: 0.075mm
  • NPTH: 0.05mm
  • CNS: 0.125mm
  • Punching: 0.15mm
  • Outline: 0.25mm (minimum)
  • V-cut: 0.40mm
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