Multilayer PCB with Tg170 and Immersion Tin Finish, for Electronic Products

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Basic Info

Payment Type:	T/T in Advance, L/C at Sight and Western Union

Product Description

Layers: 4

Board materials: FR4, Tg170

Board thickness: 0.062 inch

Surface finishing: immersion tin

Copper thickness: 1oz outer layer, 0.5oz inner layer

Solder mask: green

Minimum trace width/gap: 0.15mm (minimum)

Aperture: 0.3mm (minimum)

Peel strength: 1.25

Solder blister resistance: ≥60 (288°C)

Flammability: UL94 V0

Outline tolerance: (CNC) 0.125 and (punching) 0.15mm

Warp and twist: 0.70%

Minimum solder mask bridge: 0.0635mm

Minimum distance between line to board bridge: (outline) 0.25and (V-cut) 0.40mm

Impedance control tolerance: ±10%

Test voltage: 10 to 300V

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