PCB Manufacturing with UL 94V0 Standard and Tg150 for Electronic Products
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- Layers: four
- Board materials: FR4, Tg150
- Board thickness: 0.062ft
- Surface finishing: immersion gold
- Copper thickness: 6oz on both layer
- Solder mask: green
- Trace width/gap: 0.1mm (minimum)
- Aperture: 0.2mm (minimum)
- Peel strength: 1.25
- Solder blister resistance: ≥60 (288°C)
- Flammability: UL94 V0
- Outline tolerance: 0.125 (CNC) and 0.15mm (punching)
- Warp and twist: 0.70%
- Solder mask bridge: 0.0635mm (minimum)
- Distance between line to board bridge: 0.25 (outline) and0.40mm (V-cut) (minimum)
- Impedance control tolerance: ±10%
- Test voltage: 10 to 300V
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