High-density Mutilayer Copper PCBs with Immersion Gold Surface Finish and 4 Layers
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- Layers: 4
- Base material: FR4
- Finished board thickness: 1.6mm
- Copper thickness: 1oz
- Hole diameter: 0.2mm (minimum)
- Line width: 0.1mm (minimum)
- Line spacing: 0.1mm (minimum)
- Surface finishing: immersion gold
- Solder mask: green
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