Shenzhen Hongmy Precision Circuit Co. Ltd
Shenzhen Hongmy Precision Circuit Co. Ltd
Multi-layer PCB with 0.2mm BGA Hole Diameter and FR4 Material
  • Multi-layer PCB with 0.2mm BGA Hole Diameter and FR4 Material
Multi-layer PCB with 0.2mm BGA Hole Diameter and FR4 Material

Multi-layer PCB with 0.2mm BGA Hole Diameter and FR4 Material

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Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal or Western Union
Product Description
Product Description
  • Specifications:
    • Multi-layer PCB with BGA
    • Board material: FR4
    • Flammability: UL 94v0
    • Board thickness: 1.6mm
    • Copper thickness: 35um
    • Minimum hole diameter: 0.2mm
    • Minimum line width: 0.15mm
    • Minimum line spacing: 0.2mm
  • Multi-layer PCB with BGA
  • Board material: FR4
  • Flammability: UL 94v0
  • Board thickness: 1.6mm
  • Copper thickness: 35um
  • Minimum hole diameter: 0.2mm
  • Minimum line width: 0.15mm
  • Minimum line spacing: 0.2mm
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