Shenzhen Hongmy Precision Circuit Co. Ltd
Products
Products
Shenzhen Hongmy Precision Circuit Co. Ltd
Multilayer PCB with Tg150 Glass Transition, 0.1mm Minimum Line Width and 1oz Copper Thickness
  • Multilayer PCB with Tg150 Glass Transition, 0.1mm Minimum Line Width and 1oz Copper Thickness
Multilayer PCB with Tg150 Glass Transition, 0.1mm Minimum Line Width and 1oz Copper Thickness

Multilayer PCB with Tg150 Glass Transition, 0.1mm Minimum Line Width and 1oz Copper Thickness

Get Latest Price
Payment Type:
T/T, L/C at Sight, Western Union, PayPal
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, L/C at Sight, Western Union, PayPal
Product Description
Product Description
  • Features:
    • Board thickness: 1.6mm
    • Copper thickness: 1oz
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.154mm
    • Minimum hole diameter: 0.2mm
    • Surface finish: immersion gold, (Au 3U inches and 120U inchesNi)
    • Solder mask: green
    • Glass transition: Tg150
  • Our product range:
    • We offer a wide range of PCBs such as single-sided,double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCBand more
  • Product quality:
    • Our factories got, UL certificates and our products meet RoHSstandards
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045
    • If our PCBs can meet your requirements, welcomed to receiveyour inquiry or trial order for testing our price and quality
    • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Specifications:
    • Item manufacture capability
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
    • Layer number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210 um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp/twist: 0.70%
    • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
    • Images:
      • Minimum trace width (a): 0.075mm (3mil)
      • Minimum space width (b): 0.1mm (4mil)
      • Minimum annular ring: 0.1mm (4mil)
      • SMD pitch (a): 0.2mm (8mil)
      • BGA pitch (b): 0.2mm (8mil), 0.05mm
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5mil)
      • Solder mask clearance (b): 0.1mm (4mil)
      • Minimum SMT Pad spacing (c): 0.1mm (4mil)
      • Solder mask thickness: 0.0007 inches (0.018mm)
  • Board thickness: 1.6mm
  • Copper thickness: 1oz
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.154mm
  • Minimum hole diameter: 0.2mm
  • Surface finish: immersion gold, (Au 3U inches and 120U inchesNi)
  • Solder mask: green
  • Glass transition: Tg150
  • We offer a wide range of PCBs such as single-sided,double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCBand more
  • Our factories got, UL certificates and our products meet RoHSstandards
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045
  • If our PCBs can meet your requirements, welcomed to receiveyour inquiry or trial order for testing our price and quality
  • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Item manufacture capability
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based
  • Layer number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210 um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp/twist: 0.70%
  • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
  • Images:
    • Minimum trace width (a): 0.075mm (3mil)
    • Minimum space width (b): 0.1mm (4mil)
    • Minimum annular ring: 0.1mm (4mil)
    • SMD pitch (a): 0.2mm (8mil)
    • BGA pitch (b): 0.2mm (8mil), 0.05mm
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5mil)
    • Solder mask clearance (b): 0.1mm (4mil)
    • Minimum SMT Pad spacing (c): 0.1mm (4mil)
    • Solder mask thickness: 0.0007 inches (0.018mm)
  • Minimum trace width (a): 0.075mm (3mil)
  • Minimum space width (b): 0.1mm (4mil)
  • Minimum annular ring: 0.1mm (4mil)
  • SMD pitch (a): 0.2mm (8mil)
  • BGA pitch (b): 0.2mm (8mil), 0.05mm
  • Minimum solder mask dam (a): 0.0635mm (2.5mil)
  • Solder mask clearance (b): 0.1mm (4mil)
  • Minimum SMT Pad spacing (c): 0.1mm (4mil)
  • Solder mask thickness: 0.0007 inches (0.018mm)

    • Send your message to this supplier

    • Mr.  Peng Representative

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories