Shenzhen Hongmy Precision Circuit Co. Ltd
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Products
Shenzhen Hongmy Precision Circuit Co. Ltd
Electronic Board with 1.5mm Thickness and 0.1mm Minimum Line Width
  • Electronic Board with 1.5mm Thickness and 0.1mm Minimum Line Width
Electronic Board with 1.5mm Thickness and 0.1mm Minimum Line Width

Electronic Board with 1.5mm Thickness and 0.1mm Minimum Line Width

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Basic Info
Basic Info
Payment Type: T/T, L/C at Sight or Western Union
Product Description
Product Description
  • Features:
    • Board thickness: 1.5mm
    • Copper thickness: 1oz
    • Minimum line width: 0.1mm
    • Minimum line spacing: 0.2mm
    • Minimum hole diameter: 0.2mm
    • Surface finish: immersion gold, (Au 2 U-inch, 120 U-inchNi)
    • Solder mask: green
    • 2 pieces PCB in one panel
  • Our product range: we offer a wide range of PCBs such assingle-sided, double-sided, multilayer, high frequency, MCPCB,metal-backed PCB and more
  • Product quality:
    • We got ISO 9001, UL certificates and our products meet RoHSstandards
    • RoHS: A001C100827049001-2
    • SGS: CANEC1000312001
    • UL: E320045
  • Specifications:
    • Item manufacture capability
    • Materials: FR-4/Hi Tg FR-4/lead-free (RoHS compliant)/CEM-3,aluminum, metal-based
    • Layers: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150mils)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peelable: 0.012 (0.3mm) to 0.02 inch (0.5mm)
    • Images:
      • Minimum trace width (a): 0.075mm (3mil)
      • Minimum space width (b): 0.1mm (4mil)
      • Minimum annular ring: 0.1mm (4mil)
      • SMD pitch (a): 0.2mm (8mil)
      • BGA pitch (b): 0.2mm (8mil) 0.05mm
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5mil)
      • Soldermask clearance (b): 0.1mm (4mil)
      • Minimum SMT pad spacing (c): 0.1mm (4mil)
      • Solder mask thickness: 0.0007 inch (0.018mm)
  • Board thickness: 1.5mm
  • Copper thickness: 1oz
  • Minimum line width: 0.1mm
  • Minimum line spacing: 0.2mm
  • Minimum hole diameter: 0.2mm
  • Surface finish: immersion gold, (Au 2 U-inch, 120 U-inchNi)
  • Solder mask: green
  • 2 pieces PCB in one panel
  • We got ISO 9001, UL certificates and our products meet RoHSstandards
  • RoHS: A001C100827049001-2
  • SGS: CANEC1000312001
  • UL: E320045
  • Item manufacture capability
  • Materials: FR-4/Hi Tg FR-4/lead-free (RoHS compliant)/CEM-3,aluminum, metal-based
  • Layers: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150mils)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peelable: 0.012 (0.3mm) to 0.02 inch (0.5mm)
  • Images:
    • Minimum trace width (a): 0.075mm (3mil)
    • Minimum space width (b): 0.1mm (4mil)
    • Minimum annular ring: 0.1mm (4mil)
    • SMD pitch (a): 0.2mm (8mil)
    • BGA pitch (b): 0.2mm (8mil) 0.05mm
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5mil)
    • Soldermask clearance (b): 0.1mm (4mil)
    • Minimum SMT pad spacing (c): 0.1mm (4mil)
    • Solder mask thickness: 0.0007 inch (0.018mm)
  • Minimum trace width (a): 0.075mm (3mil)
  • Minimum space width (b): 0.1mm (4mil)
  • Minimum annular ring: 0.1mm (4mil)
  • SMD pitch (a): 0.2mm (8mil)
  • BGA pitch (b): 0.2mm (8mil) 0.05mm
  • Minimum solder mask dam (a): 0.0635mm (2.5mil)
  • Soldermask clearance (b): 0.1mm (4mil)
  • Minimum SMT pad spacing (c): 0.1mm (4mil)
  • Solder mask thickness: 0.0007 inch (0.018mm)

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