Shenzhen Hongmy Precision Circuit Co. Ltd
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Shenzhen Hongmy Precision Circuit Co. Ltd
Multi-layered PCB with FR4, Red Solder Mask and 2.0mm Board Thickness
  • Multi-layered PCB with FR4, Red Solder Mask and 2.0mm Board Thickness
Multi-layered PCB with FR4, Red Solder Mask and 2.0mm Board Thickness

Multi-layered PCB with FR4, Red Solder Mask and 2.0mm Board Thickness

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Basic Info
Basic Info
Payment Type: TT, Paypal and Western Union
Product Description
Product Description
  • Specifications:
    • Materials: FR4/Hi Tg FR-4/lead free materials (RoHSDirective-compliant)/CEM-3, aluminum, metal based
    • Layers: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150 mils)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Peelable:
      • 0.012 inches (0.3mm)
      • 0.02-inches (0.5mm)
    • Images:
      • Trace width (a): 0.075mm (3 mils) (minimum)
      • Space width (b): 0.1mm (4 mils) (minimum)
      • Annular ring: 0.1mm (4 mils) (minimum)
      • SMD pitch (a): 0.2mm (8 mils) (minimum)
      • BGA pitch (b): 0.2mm (8 mils) (minimum)
      • 0.05mm
    • Solder mask:
      • Solder mask dam (a): 0.0635mm (2.5imil) (minimum)
      • Solder mask clearance (b): 0.1mm (4 mils) (minimum)
      • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:
      • Hole size (CNC): 0.2mm (8 mils) (minimum)
      • Punch hole size: 0.9mm (35 mils) (minimum)
      • Hole size tolerance:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL: 2.5um
      • Lead-free: HASL, 2.5um
      • Immersion gold nickel: 3 to 7um
      • Au: 1 to 5u
      • OSP: 0.2 to 0.5um
  • Materials: FR4/Hi Tg FR-4/lead free materials (RoHSDirective-compliant)/CEM-3, aluminum, metal based
  • Layers: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150 mils)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Peelable:
    • 0.012 inches (0.3mm)
    • 0.02-inches (0.5mm)
  • Images:
    • Trace width (a): 0.075mm (3 mils) (minimum)
    • Space width (b): 0.1mm (4 mils) (minimum)
    • Annular ring: 0.1mm (4 mils) (minimum)
    • SMD pitch (a): 0.2mm (8 mils) (minimum)
    • BGA pitch (b): 0.2mm (8 mils) (minimum)
    • 0.05mm
  • Solder mask:
    • Solder mask dam (a): 0.0635mm (2.5imil) (minimum)
    • Solder mask clearance (b): 0.1mm (4 mils) (minimum)
    • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Hole size (CNC): 0.2mm (8 mils) (minimum)
    • Punch hole size: 0.9mm (35 mils) (minimum)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL: 2.5um
    • Lead-free: HASL, 2.5um
    • Immersion gold nickel: 3 to 7um
    • Au: 1 to 5u
    • OSP: 0.2 to 0.5um
  • 0.012 inches (0.3mm)
  • 0.02-inches (0.5mm)
  • Trace width (a): 0.075mm (3 mils) (minimum)
  • Space width (b): 0.1mm (4 mils) (minimum)
  • Annular ring: 0.1mm (4 mils) (minimum)
  • SMD pitch (a): 0.2mm (8 mils) (minimum)
  • BGA pitch (b): 0.2mm (8 mils) (minimum)
  • 0.05mm
  • Solder mask dam (a): 0.0635mm (2.5imil) (minimum)
  • Solder mask clearance (b): 0.1mm (4 mils) (minimum)
  • SMT pad spacing (c): 0.1mm (4 mils) (minimum)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Hole size (CNC): 0.2mm (8 mils) (minimum)
  • Punch hole size: 0.9mm (35 mils) (minimum)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL: 2.5um
  • Lead-free: HASL, 2.5um
  • Immersion gold nickel: 3 to 7um
  • Au: 1 to 5u
  • OSP: 0.2 to 0.5um

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