8-layer PCB with Immersion Gold Surface Finish

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Basic Info

Payment Type:	T/T, Paypal or Western Union

Product Description

Specifications:

Minimum hole diameter: 0.1mm

Minimum line width: 0.1mm

Minimum line spacing: 0.1mm

Surface finish: immersion gold

Solder mask: green

With ISO 9001, UL and RoHS marks

RoHS: A001C100827049001-2

SGS: CANEC1000312001

UL: E320045

Material: FR-4/Hi Tg FR-4/lead-free materials (RoHScompliant)/CEM-3, aluminum, metal based

Layer number: 1 to 16

Finished board thicknesses: 0.2 to 3.8mm (8 to 150mil)

Board thickness tolerance: ±10%

Cooper thicknesses: 0.5 to 6oz (18 to 210um)

Copper plating hole: 18 to 40um

Impedance control: ±10%

Warp and twist: 0.70%

Peelable: 0.012 (0.3mm) to 0.02-inch (0.5mm)

Images:

Minimum trace width: 0.075mm (3mil)

Minimum space width: 0.1mm (4mil)

Minimum annular ring: 0.1mm (4mil)

SMD pitch: 0.2mm (8mil)

BGA pitch: 0.2mm (8mil)

Solder mask:

Minimum solder mask dam: 0.0635mm (2.5mil)

Solder mask clearance: 0.1mm (4mil)

Minimum SMT pad spacing: 0.1mm (4mil)

Solder mask thickness: 0.0007 inches (0.018mm)

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