Shenzhen Hongmy Precision Circuit Co. Ltd
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Products
Shenzhen Hongmy Precision Circuit Co. Ltd
Multi-layered PCB with Lead-free HASL/FR4 Materials and 1.6mm Thickness
  • Multi-layered PCB with Lead-free HASL/FR4 Materials and 1.6mm Thickness
Multi-layered PCB with Lead-free HASL/FR4 Materials and 1.6mm Thickness

Multi-layered PCB with Lead-free HASL/FR4 Materials and 1.6mm Thickness

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Basic Info
Basic Info
Payment Type: TT, PayPal, Western Union
Product Description
Product Description
  • Our product range:
    • We offer a wide range of PCBs such as single-sided,double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCBand more
  • Product quality:
    • UL certificates and our products meet RoHS standards
    • With RoHS: A001C100827049001-2
    • With SGS: CANEC1000312001
    • With UL: E320045
    • If our PCBs can meet your requirements, welcome to receive yourinquiry or trial order for testing our price and quality
    • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Specifications:
    • Item manufacture capability
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHSDirective-compliant)/CEM-3, aluminum, metal based
    • Layer number: 1 to 16
    • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5 to 6oz (18 to 210um)
    • Copper plating hole: 18 to 40um
    • Impedance control: ±10%
    • Warp/twist: 0.70%
    • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
    • Images:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.1mm (4-mil)
      • Minimum annular ring: 0.1mm (4-mil)
      • SMD pitch (a): 0.2mm (8-mil)
      • BGA pitch (b): 0.2mm (8-mil), 0.05mm
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.1mm (4-mil)
      • Minimum SMT pad spacing (c): 0.1mm (4-mil)
      • Solder mask thickness: 0.0007 inches (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2 mm (8-mil)
      • Minimum punch hole size: 0.9 mm (35-mil)
      • Hole size tolerance (±):
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL: 2.5um
      • Lead-free HASL: 2.5um
      • Immersion gold
      • Nickel: 3 to 7um
      • Au: 1 to 5u inches
      • OSP: 0.2 to 0.5um
  • We offer a wide range of PCBs such as single-sided,double-sided, multi-layer, high-frequency, MCPCB, metal-backed PCBand more
  • UL certificates and our products meet RoHS standards
  • With RoHS: A001C100827049001-2
  • With SGS: CANEC1000312001
  • With UL: E320045
  • If our PCBs can meet your requirements, welcome to receive yourinquiry or trial order for testing our price and quality
  • We will quote to you the best price for your reference as soonas we receive your specific inquiry
  • Item manufacture capability
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHSDirective-compliant)/CEM-3, aluminum, metal based
  • Layer number: 1 to 16
  • Finished board thickness: 0.2 to 3.8mm (8 to 150-mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5 to 6oz (18 to 210um)
  • Copper plating hole: 18 to 40um
  • Impedance control: ±10%
  • Warp/twist: 0.70%
  • Peelable: 0.012 to 0.02 (0.3 to 0.5mm)
  • Images:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.1mm (4-mil)
    • Minimum annular ring: 0.1mm (4-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil), 0.05mm
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.1mm (4-mil)
    • Minimum SMT pad spacing (c): 0.1mm (4-mil)
    • Solder mask thickness: 0.0007 inches (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2 mm (8-mil)
    • Minimum punch hole size: 0.9 mm (35-mil)
    • Hole size tolerance (±):
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL: 2.5um
    • Lead-free HASL: 2.5um
    • Immersion gold
    • Nickel: 3 to 7um
    • Au: 1 to 5u inches
    • OSP: 0.2 to 0.5um
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.1mm (4-mil)
  • Minimum annular ring: 0.1mm (4-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil), 0.05mm
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.1mm (4-mil)
  • Minimum SMT pad spacing (c): 0.1mm (4-mil)
  • Solder mask thickness: 0.0007 inches (0.018mm)
  • Minimum hole size (CNC): 0.2 mm (8-mil)
  • Minimum punch hole size: 0.9 mm (35-mil)
  • Hole size tolerance (±):
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL: 2.5um
  • Lead-free HASL: 2.5um
  • Immersion gold
  • Nickel: 3 to 7um
  • Au: 1 to 5u inches
  • OSP: 0.2 to 0.5um

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