FR4 Double-sided Membrane Keypad Mobile Phone Immersion Gold PCB with 10 to 300V Test Voltage

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Basic Info

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Product Description

Specifications:

Layers: 1 to 16 layers
Materials: FR-4, CEM-1, aluminum, Rogers, Taconic, Getek andArlon
Finishing board thickness: 0.2 to 3.2mm
External copper thickness: 35 to 210um
Internal copper thickness: 17 to 140um
Copper plating hole: 18 to 40um
Trace width and line spacing: 0.075/0.1mm (3/4-mil)
Minimum CNC hole diameter: 0.20mm
Minimum punching hole diameter: 0.9mm (35-mil)
Maximum panel dimension: 610 x 508mm
Hole position tolerance: 0.075mm
Hole dimension tolerance: 0.075mm (PTH), 0.05mm (NPTH)
Outline tolerance: 0.125mm (CNC), 0.15mm (punching)
Warp and twist: 0.70%
Minimum solder mask bridge: 0.0635mm
Minimum distance between lines to board bridge: 0.25mm(outline), 0.40mm (V-cut)
Impedance control tolerance: ±10%
Test voltage: 10 to 300V
Solder mask types: green, yellow, red, white, blue, mattegreen, matte black and more
Surface finishing: HASL, immersion gold, immersion silver, goldplated, gold finger, OSP