FR4 Multilayer PCB with 0.20 to 3.2mm Thickness and Green Solder Mask Bare Board

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Basic Info

Payment Type:	T/T, L/C or Western Union

Product Description

With FR-4 base

Immersion gold

Line width/space: 0.1/0.1mm (minimum)

With UL, SGS and RoHS marks

Board thickness: 0.2 to 3.2mm

Line width: 0.1mm (minimum)

Line spacing: 0.1mm (minimum)

Hole size: 0.2mm (minimum)

Product type: aluminum, copper and iron base board

Surface finishing: HASL, immersion tin, gold plating, OSP andimmersion silver

Available in 1 to 12 layers

Dimensions: 1,100 x 480mm (maximum)

Dimensions: 5 x 5mm (minimum)

Trace and line spacing: 0.1mm (minimum)

Warp and twist: <0.5mm

Thickness: 1.6mm
Dimensions: 300 x 300mm

Finished product thickness: 0.2 to 4.5mm

Copper thickness: 18, 35, 70, 105 and 140μm

Hole inner copper thickness: 18 to 40μm

Hole position tolerance: ±0.075mm

Minimum punching hole diameter:

Board thickness <1.0mm: 1.0mm
Board thickness: 1.2 to 3.0mm: 1.5mm

Minimum punching square slot specifications:

Board thickness <1.0mm: 0.8 x 0.8mm
Board thickness 1.2 to 3.0mm: 1.0 x 1.0mm

Silk prints circuit tolerance: ±0.075mm

Outline tolerance :

CNC: ±0.1mm
Mold: ±0.75mm

Minimum whole size: 0.2mm

No limitation in maximum hole dimension

V-cut angle deviation: ±0.5°

V-cut board thickness range: 0.6 to 3.2mm

Minimum component mark character style: 0.15mm

Minimum open window for PADs: 0.01mm

Solder masks: green, white, blue, matte black and gray

Thickness: 1.6mm

Dimensions: 300 x 300mm

Board thickness <1.0mm: 1.0mm

Board thickness: 1.2 to 3.0mm: 1.5mm

Board thickness <1.0mm: 0.8 x 0.8mm

Board thickness 1.2 to 3.0mm: 1.0 x 1.0mm

CNC: ±0.1mm

Mold: ±0.75mm

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