Printed Circuit Board with 0.8mm FR-4 Material and Immersion Gold 2U
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- Layers: 2
- Board materials: FR4, ≥Tg130
- Material brand: Kingboard
- Board thickness: 0.8mm
- Surface finish: immersion gold (gold thickness: 2U)
- Copper thickness: 1oz outer layer
- Solder mask: red
- Minimum trace width/gap: 0.12mm (minimum)
- Aperture: 0.25mm (minimum)
- Peel strength: 1.25
- Solder blister resistance: ≥60 (288°C)
- Flammability: UL94 V0
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