Telecom/Amplifier Product with Silkscreen/Pad Printing and Surface-mount Technology

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Plastic molding and injection

Sheet metal stamping and punching and stamping dies

Painting lines

Die casting lines

Powder coating lines

Silkscreen and pad printing

High-speed SMT and DIP assembly

Chip-on-board (COB)

Surface-mount technology (SMT)

Ball-grid array (BGA)

Materials: ABS, PP, POM, PVC, TPR, TPU, PA and glass fiber or any specific materials upon customers' requests

Product requirement like dual-injection, high temperature-endurance, high hardness and others are available upon request

Flexible surface finish such as chrome plating, painting, water transfer printing, texture and more are available

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