Shenzhen Leadsin Technology Co. Ltd
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Products
Shenzhen Leadsin Technology Co. Ltd
Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness
  • Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness
  • Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness
Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness
Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness

Aluminum Base PCBA for LEDs, with 1.0mm Board Thickness

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Basic Info
Basic Info
Payment Type: Paypal
Product Description
Product Description
  • Description:
    • Material: aluminum
    • Board thickness: 1.0mm
    • Copper thickness: 0.5oz
    • Surface treatment: HASL lead-free
    • Solder mask: black
    • Silkscreen: white
    • 112 pieces highlight LEDs from original Kingbright brand
    • Products experience range: traffic lights, infrared LED for car, streetlights, flashlight, and billboards
    • Indoor/outdoor LED display and more
    • Hoaxing can offer one-stop service from schematic design, board layout, component selection, firmware design, and mechanical design to PCBA and chip cloning
  • Printed circuit board:
    • Materials: FR-4 (standard FR4, Mid-Tg FR4, Hi-Tg FR4, lead-free assembly material), halogen-free, ceramic filled, Teflon, polyimide, BT, PPO, PPE, hybrid, partial hybrid and more
    • Layers:
      • Mass production: 2 to 20 layers
      • Pilot run: 30 layers
    • Maximum thickness:
      • Mass production: 394 mils (10mm)
      • Pilot run: 17.5mm
    • Minimum width/space:
      • Inner layer: 3/3 mils (Hoz)
      • Outer layer: 4/4 mils (1oz)
    • Minimum hole size:
      • Mechanical drill: 8 mils (0.2mm)
      • Laser drill: 3 mils (0.075mm)
      • Maximum panel size: 1,150 x 560mm
    • Surface finishing: HASL, immersion gold, immersion tin, OSP, ENIG + OSP, immersion silver, ENEPIG and gold finger
    • Special process: buried hole, blind hole, embedded resistance, embedded capacity, hybrid, partial hybrid, partial high-density, back drilling
    • SMT:
      • Position accuracy: 20um
      • Components size: 0.4 x 0.2mm (01005), —130 x 79mm, flip-chip, QFP, BGA and POP
      • Maximum component height: 25mm
      • Maximum PCB size: 680 x 500mm
      • PCB thickness: 0.3 to 6mm
      • PCB weight: 3kg
    • Wave-solder:
      • Maximum PCB width: 450mm
      • Component height: top 120mm/bottom 15mm
    • Sweat-solder:
      • Metal type: part, whole, inlay and sidestep
      • Metal material: copper and aluminum
      • Surface finishing: plating aluminum, plating sliver, plating SN
      • Air blade rate: less than 20%
      • Testing: ICT, probe flying, burn-in, function test, temperature cycling
  • Material: aluminum
  • Board thickness: 1.0mm
  • Copper thickness: 0.5oz
  • Surface treatment: HASL lead-free
  • Solder mask: black
  • Silkscreen: white
  • 112 pieces highlight LEDs from original Kingbright brand
  • Products experience range: traffic lights, infrared LED for car, streetlights, flashlight, and billboards
  • Indoor/outdoor LED display and more
  • Hoaxing can offer one-stop service from schematic design, board layout, component selection, firmware design, and mechanical design to PCBA and chip cloning
  • Materials: FR-4 (standard FR4, Mid-Tg FR4, Hi-Tg FR4, lead-free assembly material), halogen-free, ceramic filled, Teflon, polyimide, BT, PPO, PPE, hybrid, partial hybrid and more
  • Layers:
    • Mass production: 2 to 20 layers
    • Pilot run: 30 layers
  • Maximum thickness:
    • Mass production: 394 mils (10mm)
    • Pilot run: 17.5mm
  • Minimum width/space:
    • Inner layer: 3/3 mils (Hoz)
    • Outer layer: 4/4 mils (1oz)
  • Minimum hole size:
    • Mechanical drill: 8 mils (0.2mm)
    • Laser drill: 3 mils (0.075mm)
    • Maximum panel size: 1,150 x 560mm
  • Surface finishing: HASL, immersion gold, immersion tin, OSP, ENIG + OSP, immersion silver, ENEPIG and gold finger
  • Special process: buried hole, blind hole, embedded resistance, embedded capacity, hybrid, partial hybrid, partial high-density, back drilling
  • SMT:
    • Position accuracy: 20um
    • Components size: 0.4 x 0.2mm (01005), —130 x 79mm, flip-chip, QFP, BGA and POP
    • Maximum component height: 25mm
    • Maximum PCB size: 680 x 500mm
    • PCB thickness: 0.3 to 6mm
    • PCB weight: 3kg
  • Wave-solder:
    • Maximum PCB width: 450mm
    • Component height: top 120mm/bottom 15mm
  • Sweat-solder:
    • Metal type: part, whole, inlay and sidestep
    • Metal material: copper and aluminum
    • Surface finishing: plating aluminum, plating sliver, plating SN
    • Air blade rate: less than 20%
    • Testing: ICT, probe flying, burn-in, function test, temperature cycling
  • Mass production: 2 to 20 layers
  • Pilot run: 30 layers
  • Mass production: 394 mils (10mm)
  • Pilot run: 17.5mm
  • Inner layer: 3/3 mils (Hoz)
  • Outer layer: 4/4 mils (1oz)
  • Mechanical drill: 8 mils (0.2mm)
  • Laser drill: 3 mils (0.075mm)
  • Maximum panel size: 1,150 x 560mm
  • Position accuracy: 20um
  • Components size: 0.4 x 0.2mm (01005), —130 x 79mm, flip-chip, QFP, BGA and POP
  • Maximum component height: 25mm
  • Maximum PCB size: 680 x 500mm
  • PCB thickness: 0.3 to 6mm
  • PCB weight: 3kg
  • Maximum PCB width: 450mm
  • Component height: top 120mm/bottom 15mm
  • Metal type: part, whole, inlay and sidestep
  • Metal material: copper and aluminum
  • Surface finishing: plating aluminum, plating sliver, plating SN
  • Air blade rate: less than 20%
  • Testing: ICT, probe flying, burn-in, function test, temperature cycling

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