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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Double-sided multi-layer

Number of layers: 2 1-22

Copper thickness: 0.25-3.0, 0.5-3.0oz

Base board thickness: 0.3-3.2, 0.6-7.0mm

Incombustibility: 94V-0

Peelable resistance: 12.3N/cm

Twist: ≤0.5%

Insulation resistance: ≥1,011Ω

Test voltage: 10-300V

Finished board area: 560×970mm

Minimum line width and spacing: 0.1/0.1mm

Copper thickness in hole: ≥25.0um

Minimum pad diameter inner layer: 0.05mm

Out layer: 0.076mm

Minimum hole diameter: 0.25 and 0.20mm

Hole tolerance: PTH ±0.076mm

NPTH: ±0.05mm

Hole location tolerance: ±0.076 and ±0.05mm

Profile tolerance routing: ±0.1mm

Punching: ±0.13mm

Solder mask bridge ability: ≥0.1 and ≥0.075mm

Solder mask rigidity: 6 hours

Solderable test: 245ºC, 5 seconds

Thermal cycling ability: 288ºC, 10 seconds

Surface finishing: OSP, HAL, immersion gold, gold plating, rosin, gold finger OSP, HAL, immersion gold, gold

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