Shenzhen Leadsin Technology Co. Ltd
Shenzhen Leadsin Technology Co. Ltd
Enclose mold and main control board assembly for LED light
  • Enclose mold and main control board assembly for LED light
Enclose mold and main control board assembly for LED light

Enclose mold and main control board assembly for LED light

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Plastic molding and injection
  • Sheet metal stamping and punching
  • Painting lines
  • Die-casting lines
  • Powder coating lines
  • Silkscreen and pad printing
  • High-speed SMT and DIP assembly
  • Chip-on board (COB)
  • Surface mount technology (SMT)
  • Ball-grid array (BGA)
  • Through-hole
  • Building products experience range: industrial, automotive, computing, storage, consumer, instrumentation, medical, networking, peripherals and telecommunications
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