Shenzhen Leadsin Technology Co. Ltd
Shenzhen Leadsin Technology Co. Ltd
PCB Assembly, Microchip Programming and Functional Testing
  • PCB Assembly, Microchip Programming and Functional Testing
PCB Assembly, Microchip Programming and Functional Testing
PCB Assembly, Microchip Programming and Functional Testing
PCB Assembly, Microchip Programming and Functional Testing

PCB Assembly, Microchip Programming and Functional Testing

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Basic Info
Basic Info
Payment Type: T/T, L/C
Product Description
Product Description
  • Material: FR4 TG150
  • Setup: 1 + 4 + 1
  • Finished board thickness: 0.9 ± 0.1mm
  • Minimum width/spacing: 0.075/0.075 ± 0.1mm
  • Minimum laser drilling hole: 0.1mm
  • Surface finish: ENIG + OSP
  • Specialty: blind and buried via, impedance control
  • Application field: communication
  • OEM, EMS and ODM services are provided
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