Shenzhen Sunshine Circuits Technology Co. Ltd
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Shenzhen Sunshine Circuits Technology Co. Ltd
Multilayer PCB, with Layer Count of 6, Buried via + thick copper + Hi-Pot test
  • Multilayer PCB, with Layer Count of 6, Buried via + thick copper + Hi-Pot test
Multilayer PCB, with Layer Count of 6, Buried via + thick copper + Hi-Pot test

Multilayer PCB, with Layer Count of 6, Buried via + thick copper + Hi-Pot test

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count: 6
  • Finish thickness: 1.676 ±0.152mm
  • Minimum width/spacing: 10/10 mil
  • Minimum via diameter:
    • Via buried: 0.3mm
    • PTH: 0.5mm
  • Surface finish: lead-free HAL
  • Specialty:
    • L2-3 and L4-5: via buried and via copper
    • Thickness: 25um
    • PTH copper thickness: 35um
    • Inner and outer copper thickness: 140um
  • Via buried: 0.3mm
  • PTH: 0.5mm
  • L2-3 and L4-5: via buried and via copper
  • Thickness: 25um
  • PTH copper thickness: 35um
  • Inner and outer copper thickness: 140um

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