Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
14-layered Impedance Board with ENIG Surface Finish and 0.25mm Minimum Via Diameter
  • 14-layered Impedance Board with ENIG Surface Finish and 0.25mm Minimum Via Diameter
14-layered Impedance Board with ENIG Surface Finish and 0.25mm Minimum Via Diameter

14-layered Impedance Board with ENIG Surface Finish and 0.25mm Minimum Via Diameter

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count: 14
  • Finish thickness: 1.6±0.2mm
  • Minimum width/spacing:
    • Outer layer :4/5mil
    • Inner layer: 3.7/4mil
  • Minimum via diameter: 0.25mm
  • Surface finish: ENIG
  • Specialty:
    • Inner via to line: 8mil
    • Annular ring: 5mil
    • Divider: 7.9mil
  • Outer layer :4/5mil
  • Inner layer: 3.7/4mil
  • Inner via to line: 8mil
  • Annular ring: 5mil
  • Divider: 7.9mil
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