Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
High-layer VOP Board with ENIG Surface Finish
  • High-layer VOP Board with ENIG Surface Finish
High-layer VOP Board with ENIG Surface Finish

High-layer VOP Board with ENIG Surface Finish

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer counts: 16
  • Finish thickness: 2.184 ± 0.178mm
  • Minimum width/spacing: 4/4mil
  • Minimum via diameter: 0.25mm
  • Surface finish: ENIG
  • Specialty: minimum via diameter are on the PAD and filled with resin
  • L1, L4, L5, L8, L9, L12, L13, L16:
    • Characteristic impedance: 50 ± 10%Ω
    • Differential impedance: 100 ± 10%Ω
  • Characteristic impedance: 50 ± 10%Ω
  • Differential impedance: 100 ± 10%Ω
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