Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
Multiple-layered PCB, Mechanical Blind Via 0.35mm and Thick Copper Board
  • Multiple-layered PCB, Mechanical Blind Via 0.35mm and Thick Copper Board
Multiple-layered PCB, Mechanical Blind Via 0.35mm and Thick Copper Board

Multiple-layered PCB, Mechanical Blind Via 0.35mm and Thick Copper Board

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Specifications:
    • Layer count: 8
    • Finish thickness: 2.667 ±0.254mm
    • Minimum via diameter: 0.4mm
    • Surface finish: ENIG
  • Specialty:
    • L1 to 4, L5 to 8: mechanical
    • Blind via of: 0.35mm
    • Annular ring: 3 mils
    • All blind via are filled by resin
    • Outer and inner layer copper thickness: 4oz
  • Layer count: 8
  • Finish thickness: 2.667 ±0.254mm
  • Minimum via diameter: 0.4mm
  • Surface finish: ENIG
  • L1 to 4, L5 to 8: mechanical
  • Blind via of: 0.35mm
  • Annular ring: 3 mils
  • All blind via are filled by resin
  • Outer and inner layer copper thickness: 4oz
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    • Mr.  Martin

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