
Multiple-layered PCB, Mechanical Blind Via 0.35mm and Thick Copper Board
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- Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Payment Type: | Telegraphic Transfer in Advance (Advance TT, T/T) |
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Product Description
Product Description
- Layer count: 8
- Finish thickness: 2.667 ±0.254mm
- Minimum via diameter: 0.4mm
- Surface finish: ENIG
- L1 to 4, L5 to 8: mechanical
- Blind via of: 0.35mm
- Annular ring: 3 mils
- All blind via are filled by resin
- Outer and inner layer copper thickness: 4oz
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