Multilayer PCB, Board Filled with Copper Paste

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 10

Finish thickness: 1.575 ± 10%mm

Minimum width/spacing: 4/4-mil

Minimum via dia: 0.2mm

Surface finish: ENIG

Specialty: all VIA are filled with copper paste

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