Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
Stack Via & Impedance 2+2+2 HDI
  • Stack Via & Impedance 2+2+2 HDI
  • Stack Via & Impedance 2+2+2 HDI
Stack Via & Impedance 2+2+2 HDI
Stack Via & Impedance 2+2+2 HDI

Stack Via & Impedance 2+2+2 HDI

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count 6
  • Finish thickness: 1.60±10%mm
  • Min. width/spacing: 0.12/0.12mm
  • Surface: Finish ENIG
  • Specialty L1-2, L2-3: copper fill with laser drill
  • L1-3: stack via
  • L1, L6: differential impedance of 100±10%Ω
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