Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
High Impedance Board with Immersion Silver Surface Finish
  • High Impedance Board with Immersion Silver Surface Finish
High Impedance Board with Immersion Silver Surface Finish

High Impedance Board with Immersion Silver Surface Finish

Payment Type:
Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Finish thickness: 0.62±0.1mm
  • Minimum width/spacing: 5/5mil
  • Minimum Via diameter: 0.3mm
  • Surface finish: immersion silver
  • Specialty:
    • Material: rogers, Ro4oo3C, 0.508mmH/HOZ finish
    • Copper thickness: 40-70um
  • Material: rogers, Ro4oo3C, 0.508mmH/HOZ finish
  • Copper thickness: 40-70um
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